
P321 – HV inline sputter deposition system INCOATEC
Application
HV inline sputter deposition system for thin film and multilayer deposition at special sized substrates for X-Ray mirror production
Year of delivery
2012
Installation site
INCOATEC GmbH, Geesthacht, Germany
Design Features
- Inline HV magnetron sputter deposition system with full automatic control system for x-ray mirror production with very high film uniformity below 1%.
- Four rectangular magnetrons (target size: 12″ x 3.5″) in face to face configuration.
- Each magnetron mounted at a differentially pumped fliping door for fast and easy target exchange and source cleaning.
- Source shutter and direct gas inlet close to the target installed at each magnetron.
- Low pressure sputtering possible.
- In situ adjustable (stepper motor driven) aperture between targets and substrate.
- Motorized sample trolley with speed profile motion mode as well as constant speed motion mode implemented.
- Encapsulated and differentially pumped ball screw spindle drive.
- Maximal sample size of 400mm x 160mm x 80 mm.
- Residual gas analysis installed at the sputtering chamber.
- Load lock chamber with automatic sample transfer system and sliding access door.
Special Features
- Large motion speed range from about 33 µm/s up to 50mm/s possible.
- Optical system for backlash detection of the motion drive spindle.
Outer Dimensions
Technical specifications and performance values
General
Sputtering chamber
Size
Cubic shape chamber, about 4060 mm length, about 880 mm width & about 800 mm height
Material
stainless steel
Load lock chamber
Size
500 mm diameter, about 615 mm length
Material
stainless steel
Vacuum
Sputtering chamber
Base pressure
< 10-7 mbar
Pump down time
8 hours to < 10-8 mbar
Chamber pumping
Turbo pumping stage incl. water vapor cryo trap, several chamber doors are differentially pumped by dry foreline pump
Load lock chamber
Base pressure
< 2 * 10-6 mbar
Pump down time
1 hour to < 10-5 mbar
Chamber pumping
Turbo pumping stage with dry foreline pump
Manipulator features
Sputtering chamber
Sample size
max. 400mm x 160mm x 80 mm special shaped samples
Motion axes
Motorized sample translation axis with motion speed range of min. 33 µm/s up to max. 50 mm/s, incl. speed profile feature